Grinding of solids

Copper CMP slurry (Materials for Semiconductor Manufacturing Process)

An abrasive that can polish with micro fineness semiconductor substrate surfaces containing metal, dielectrics, etc.

Based on electrochemical reactions and the technology for many functional materials, this slurry contributes to high-speed and uniform copper polishing while controlling dishing and erosion. In addition, by optimizing the chemistry to match the specific substrate in barrier polishing, it is possible to achieve the polishing selection ratio desirable for individual substrates.


  • Material Chemistry
  • Optics
  • Fujifilm Original